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| STGB18N40LZ STGD18N40LZ EAS 180 mJ - 400 V - internally clamped IGBT Features AEC Q101 compliant 180 mJ of avalanche energy @ TC = 150 C, L = 3 mH ESD gate-emitter protection Gate-collector high voltage clamping Logic level gate drive Low saturation voltage 3 3 2 1 1 3 IPAK DPAK High pulsed current capability Gate and gate-emitter resistor IPAK 3 12 1 DPAK Application Pencil coil electronic ignition driver Figure 1. Internal schematic diagram Description This IGBT utilizes the advanced PowerMESHTM process resulting in an excellent trade-off between switching performance and low on-state behavior. Table 1. Device summary Marking GD18N40LZ GD18N40LZ GB18N40LZ GB18N40LZ Package DPAK IPAK DPAK IPAK Packaging Tape and reel Tube Tape and reel Tube Order codes STGD18N40LZT4 STGD18N40LZ-1 STGB18N40LZT4 STGB18N40LZ-1 March 2008 Rev 2 1/18 www.st.com 18 Contents STGD18N40LZ - STGB18N40LZ Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 Test circuits ............................................... 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/18 STGD18N40LZ - STGB18N40LZ Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter DPAK IPAK VCES VECS IC (1) ICP (2) VGE PTOT EAS EAS Collector-emitter voltage (vGE = 0) Emitter collector voltage (VGE = 0) Collector current (continuous) at TC = 100 C Pulsed collector current Gate-emitter voltage Total dissipation at TC = 25 C Single pulse energy TC= 25 C, L = 3 mH, RG = 1 K Single pulse energy TC=150 C, L = 3 mH, RG = 1 K Human body model, R= 1550 C = 100 pF , ESD Machine model, R = 0, C = 100 pF Charged device model Tstg Tj Storage temperature - 55 to 175 Operating junction temperature C 25 40 VGE(clamped) 125 300 180 8 800 2 150 DPAK IPAK V V 30 A A V W mJ mJ kV V kV Unit VCES(clamped) 20 1. Calculated according to the iterative formula: T -T JMAX C I ( T ) = ----------------------------------------------------------------------------------------------------CC R xV (T , I ) THJ - C CESAT ( MAX ) C C 2. Pulse width limited by max. junction temperature allowed Table 3. Thermal resistance Value Symbol Parameter DPAK IPAK DPAK IPAK 1 62.5 Unit Rthj-case Rthj-amb Thermal resistance junction-case max Thermal resistance junction-ambient max 1.2 65 C/W C/W 3/18 Electrical characteristics STGD18N40LZ - STGB18N40LZ 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol Static electrical characteristics Parameter Test conditions IC = 2 mA, RG = 1 k TC = - 40 C to 150 C Min. Typ. Max. Unit Collector emitter VCES(clamped) clamped voltage (VGE = 0) V(BR)ECS Emitter collector break-down voltage (VGE = 0) Gate emitter clamped voltage Collector cut-off current (VGE = 0) Gate cut-off current (VCE = 0) Gate emitter resistance Gate resistance 370 400 430 V IC = 75 mA 20 28 V VGE(clamped) IG = 2 mA VCE = 15 V, TC = 150 C VCE = 200 V,TC = 150 C VGE = 10 V 12 16 10 100 V A A A K K V ICES IGES RGE RG 450 12 625 16 1.6 830 22 VCE = 12 V, IC = 1 mA,TC = -40 C VGE(th) Gate threshold voltage VCE = 12 V, IC = 1 mA VCE = 12 V, IC = 1 mA, TC =150 C VGEP Gate emitter plateau VCE = 12 V, IC = 10 A voltage VGE = 4.5 V, IC = 10 A VCE(sat) Collector emitter saturation voltage VGE = 4.5 V, IC = 10 A, TC = 150 C VGE = 3.8 V, IC = 6 A 1.4 1.2 0.7 2.9 1.35 1.30 1.30 1.7 1.6 2.3 V V V V V V 4/18 STGD18N40LZ - STGB18N40LZ Electrical characteristics Table 5. Symbol Cies Coes Cres Qg Dynamic electrical characteristics Parameter Input capacitance Output capacitance Reverse transfer capacitance Gate charge VCE = 280 V, IC = 10 A, VGE = 5 V VCE = 25 V, f = 1 MHz, VGE = 0 Test conditions Min. Typ. 490 90 6.5 23 Max. Unit pF pF pF nC Table 6. Symbol Switching on/off Parameter Resistive load Turn-on delay time Rise time Resistive load Turn-on delay time Rise time Inductive load Turn-off delay time Fall time Turn-off voltage slope Inductive load Turn-off delay time Fall time Turn-off voltage slope Test conditions VCC = 14 V, IC = 10 A , RG = 1 k VGE = 5 V VCC = 14 V, IC = 10 A , RG = 1 k VGE = 5 V, TC = 150 C VCC = 300 V, L = 1 mH , RG = 1 k VGE = 5 V Min. Typ. Max. Unit td(on) tr td(on) tr td(off) tf dv/dt td(off) tf dv/dt 1 5.8 1 5.9 14 6.7 90 15 9.8 80 s s s s s s V/s s s V/s VCC = 300 V, L = 1 mH , RG = 1 k VGE = 5 V TC = 150 C 5/18 Electrical characteristics STGD18N40LZ - STGB18N40LZ 2.1 Figure 2. Electrical characteristics (curves) Collector-emitter voltage vs temperature Figure 3. Collector-emitter voltage vs temperature Figure 4. Collector-emitter voltage vs temperature Figure 5. Self clamped inductive switch Figure 6. 60 IC (A) Collector current vs collector emitter voltage @ 25 C HV42380 V GE = 8 V V GE = 4.5 V Figure 7. IC (A) 60 Collector current vs collector emitter voltage @ -40 C HV42390 VGE = 8 V 50 50 V GE = 5 V 40 VGE = 4.5 V VGE = 4 V V GE = 4 V 40 VGE = 5 V 30 V GE = 3.8 V VGE = 3.8 V 30 20 T C = 25 C 10 20 TC = -40 C 10 0 0 1 2 3 4 5 V CE (V) 0 0 1 2 3 4 5 VCE (V) 6 6/18 STGD18N40LZ - STGB18N40LZ Figure 8. 60 IC (A) VGE = 8 V Electrical characteristics Figure 9. 30 IC (A) Collector current vs collector emitter voltage @ 175 C HV42400 Transfer characteristics HV38710 VGE = 5 V VGE = 4.5 V VGE = 4 V 50 40 30 20 24 18 VGE = 3.8 V 12 TC = 175 C 10 0 0 1 2 3 4 5 VCE (V) 6 TC = 25 C TC = 175 C TC = -40 C 6 0 1 2 3 4 VGE (V) 5 Figure 10. Collector emitter leakage current vs. temperature Figure 11. Normalized collector emitter breakdown voltage vs temperature Figure 12. Normalized gate threshold voltage vs temperature Figure 13. Normalized collector emitter voltage vs temperature 7/18 Electrical characteristics Figure 14. Thermal impedance for DPAK / IPAK STGD18N40LZ - STGB18N40LZ Figure 15. Thermal impedance for DPAK / IPAK 8/18 STGD18N40LZ - STGB18N40LZ Test circuits 3 Test circuits Figure 17. Gate charge test circuit Figure 16. Test circuit for inductive load switching Figure 18. Switching waveform Figure 19. Test circuit for resistive load switching 9/18 Package mechanical data STGD18N40LZ - STGB18N40LZ 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/18 STGD18N40LZ - STGB18N40LZ Package mechanical data TO-252 (DPAK) mechanical data DIM. A A1 A2 b b4 c c2 D D1 E E1 e e1 H L L1 L2 L4 R V2 0o 0.60 0.20 8o 4.40 9.35 1 2.80 0.80 1 6.40 4.70 2.28 4.60 10.10 mm. min. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.10 6.60 typ max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 0068772_G 11/18 Package mechanical data STGD18N40LZ - STGB18N40LZ TO-251 (IPAK) mechanical data mm. DIM. A A1 b b2 b4 c c2 D E e e1 H L (L1) L2 V1 9.00 0.80 0.80 10 o 4.40 16.10 9.40 1.20 5.20 0.45 0.48 6.00 6.40 2.28 4.60 min. 2.20 0.90 0.64 typ max. 2.40 1.10 0.90 0.95 5.40 0.60 0.60 6.20 6.60 0068771_H 12/18 STGD18N40LZ - STGB18N40LZ Package mechanical data DPAK (TO-263) mechanical data mm Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 2.54 4.88 15 2.49 2.29 1.27 1.30 0.4 0 8 0 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 Typ Max 4.60 0.23 0.93 1.70 0.60 1.36 9.35 10.40 Min 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 inch Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8 0079457_M 13/18 Package mechanical data STGD18N40LZ - STGB18N40LZ IPAK (TO-262) mechanical data mm Dim Min A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 Typ Max 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Min 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 inch Typ Max 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 14/18 STGD18N40LZ - STGB18N40LZ Packaging mechanical data 5 Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W BASE QTY 2500 mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 16.3 inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.6 1.85 7.6 2.75 4.1 8.1 2.1 15/18 Packaging mechanical data STGD18N40LZ - STGB18N40LZ D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 16/18 STGD18N40LZ - STGB18N40LZ Revision history 6 Revision history Table 7. Date 18-Jan-2008 07-Mar-2008 Document revision history Revision 1 2 Initial release. Modified Figure 7, Figure 8, Figure 10. Changes 17/18 STGD18N40LZ - STGB18N40LZ Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18 |
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